Encapsulate & Protect Cable Assemblies

Low Pressure Overmoulding offers a more cost effective and consistent process to encapsulate and protect cable assemblies compared to bespoke cases made from plastic injection moulding.

The process is performed at low pressure and at a temperature that does not damage pcb assemblies.  The process uses a specially designed mould which the assembly is placed in and then a Henkel macromelt compound is injected into the mould.

The main advantages of overmoulding include: