Low Pressure Overmoulding offers a more cost effective and consistent process to encapsulate and protect cable assemblies compared to bespoke cases made from plastic injection moulding.
The process is performed at low pressure and at a temperature that does not damage pcb assemblies. The process uses a specially designed mould which the assembly is placed in and then a Henkel macromelt compound is injected into the mould.
The main advantages of overmoulding include:
